In addition to surface and subsurface defects, residual stress represents a concern. Over time, these stress points, ...

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

The cause of failure in engineering structures is routinely investigated via the detailed study of material fracture surfaces. This remains a key research area in material sciences, with researchers ...