Eunil H.A. Americas has added the PARMI SPI HS30 in-line solder paste inspection system to its product line. The SPI HS30 uses a 3D laser triangulation sensor and intelligent vision algorithm to ...

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...

Previously, a Power Electronics Technology article titled “Inverted Acoustic System Cuts IGBT Failures” (September 2011) examined the use of an acoustic microscope to image heat-blocking defects such ...

OAKLAND, Calif.--(BUSINESS WIRE)--Digicom Electronics, Inc., a technology and quality driven electronics manufacturing services company, presents its new Diamond Track Defect Mitigation Services at ...